Chemicals and Materials

Hybrid Memory Cube (HMC) and High Bandwidth Memory (HBM) Consumption Market Report


Hybrid Memory Cube (HMC) and High Bandwidth Memory (HBM)4061.jpg

In this report, We covers the present scenario (with the base year being 2017) and the growth prospects of global Hybrid Memory Cube (HMC) and High Bandwidth Memory (HBM) market for 2018-2023.

High Bandwidth Memory (HBM) is a high-performance RAM interface for 3D-stacked DRAM from AMD and Hynix. It is to be used in conjunction with high-performance graphics accelerators and network devices. Hybrid Memory Cube (HMC) is a high-performance RAM interface for through-silicon vias (TSV)-based stacked DRAM memory competing with the incompatible rival interface High Bandwidth Memory (HBM).

In terms of geographic regions, APAC is expected to grow at the highest CAGR during the forecast period. The major drivers for the rapid growth of the HMC and HBM market in APAC are the growing number of data centers and servers, increasing shipments of network equipment, and the rising number of manufacturing activities in the enterprise storage and consumer electronics sectors. The strong economic growth and growing demand for high-density memories is expected to drive the HMC and HBM market in the APAC region.

Over the next five years, our projects that Hybrid Memory Cube (HMC) and High Bandwidth Memory (HBM) will register a xx% CAGR in terms of revenue, reach US$ xx million by 2023, from US$ xx million in 2017.

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This report presents a comprehensive overview, market shares, and growth opportunities of Hybrid Memory Cube (HMC) and High Bandwidth Memory (HBM) market by product type, application, key manufacturers and key regions.

To calculate the market size,We considers value and volume generated from the sales of the following segments:

Segmentation by product type:

  • Hybrid Memory Cube (HMC)
  • High-bandwidth memory (HBM)

Segmentation by application:

  • Graphics
  • High-performance Computing
  • Networking
  • Data Centers

The report also presents the market competition landscape and a corresponding detailed analysis of the major vendor/manufacturers in the market.

The key manufacturers covered in this report:

  • Micron
  • Samsung
  • SK Hynix
  • Advanced Micro Devices
  • Intel
  • Xilinx
  • Fujitsu
  • Nvidia
  • IBM
  • Open-Silicon
  • Cadence
  • Marvell

In addition, this report discusses the key drivers influencing market growth, opportunities, the challenges and the risks faced by key manufacturers and the market as a whole. It also analyzes key emerging trends and their impact on present and future development.

Research objectives

  • To study and analyze the global Hybrid Memory Cube (HMC) and High Bandwidth Memory (HBM) consumption (value & volume) by key regions/countries, product type and application, history data from 2013 to 2017, and forecast to 2023.
  • To understand the structure of Hybrid Memory Cube (HMC) and High Bandwidth Memory (HBM) market by identifying its various subsegments.
  • Focuses on the key global Hybrid Memory Cube (HMC) and High Bandwidth Memory (HBM) manufacturers, to define, describe and analyze the sales volume, value, market share, market competition landscape, SWOT analysis and development plans in next few years.
  • To analyze the Hybrid Memory Cube (HMC) and High Bandwidth Memory (HBM) with respect to individual growth trends, future prospects, and their contribution to the total market.
  • To share detailed information about the key factors influencing the growth of the market (growth potential, opportunities, drivers, industry-specific challenges and risks).
  • To project the consumption of Hybrid Memory Cube (HMC) and High Bandwidth Memory (HBM) submarkets, with respect to key regions (along with their respective key countries).
  • To analyze competitive developments such as expansions, agreements, new product launches, and acquisitions in the market.
  • To strategically profile the key players and comprehensively analyze their growth strategies.

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Table of content

2018-2023 Global Hybrid Memory Cube (HMC) and High Bandwidth Memory (HBM) Consumption Market Report

1 Scope of the Report
1.1 Market Introduction
1.2 Research Objectives
1.3 Years Considered
1.4 Market Research Methodology
1.5 Economic Indicators
1.6 Currency Considered

2 Executive Summary
2.1 World Market Overview
2.1.1 Global Hybrid Memory Cube (HMC) and High Bandwidth Memory (HBM) Consumption 2013-2023
2.1.2 Hybrid Memory Cube (HMC) and High Bandwidth Memory (HBM) Consumption CAGR by Region
2.2 Hybrid Memory Cube (HMC) and High Bandwidth Memory (HBM) Segment by Type
2.2.1 Hybrid Memory Cube (HMC)
2.2.2 High-bandwidth memory (HBM)
2.3 Hybrid Memory Cube (HMC) and High Bandwidth Memory (HBM) Consumption by Type
2.3.1 Global Hybrid Memory Cube (HMC) and High Bandwidth Memory (HBM) Consumption Market Share by Type (2013-2018)
2.3.2 Global Hybrid Memory Cube (HMC) and High Bandwidth Memory (HBM) Revenue and Market Share by Type (2013-2018)
2.3.3 Global Hybrid Memory Cube (HMC) and High Bandwidth Memory (HBM) Sale Price by Type (2013-2018)
2.4 Hybrid Memory Cube (HMC) and High Bandwidth Memory (HBM) Segment by Application
2.4.1 Graphics
2.4.2 High-performance Computing
2.4.3 Networking
2.4.4 Data Centers
2.5 Hybrid Memory Cube (HMC) and High Bandwidth Memory (HBM) Consumption by Application
 

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