Machinery and Equipments

Die Bonder Equipment Market Professional Survey Report 2018


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This report studies the global Die Bonder Equipment market status and forecast, categorizes the global Die Bonder Equipment market size (value & volume) by manufacturers, type, application, and region. This report focuses on the top manufacturers in North America, Europe, Japan, China, India, Southeast Asia and other regions (Central & South America, and Middle East & Africa).

Die bonding is the process of attaching a die/chip to a substrate or package. Die bonding is accomplished by using one of the following processes: 1. Eutectic; 2. Solder; 3. Adhesive; 4. Glass or Silver-Glass
Die Bonder Equipment industry is highly concentrated, manufacturers are mostly in the Asia, Europe and US. Among them, Europe output volume accounted for more than 32.09% of the total output of global Die Bonder Equipment in 2016. Besi is the world leading manufacturer in global Die Bonder Equipment market with the market share of 39.21%, in terms of revenue.
With the increasing in production capacity, expected that the Die Bonder Equipment raw material price will be stable in the short term. However, the improvement of energy, transportation costs, and labor costs, will play a significant role in promoting the cost of Die Bonder Equipment.
The average price of Die Bonder Equipment will fall further. The product average price trend in the past few years was not stable, however, due to the mature manufacturing technology, cost of raw materials, as well as the substitute threat, the average price will decrease in the few future years.
The global Die Bonder Equipment market is valued at xx million US$ in 2017 and will reach xx million US$ by the end of 2025, growing at a CAGR of xx% during 2018–2025.

The major manufacturers covered in this report

  • Besi
  • ASM Pacific Technology (ASMPT)
  • Kulicke & Soffa
  • Palomar Technologies
  • Shinkawa
  • DIAS Automation
  • Toray Engineering
  • Panasonic
  • FASFORD TECHNOLOGY
  • West-Bond
  • Hybond

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Geographically, this report studies the top producers and consumers, focuses on product capacity, production, value, consumption, market share and growth opportunity in these key regions, covering

  • North America
  • Europe
  • China
  • Japan
  • India
  • Southeast Asia
  • Other regions (Central & South America, Middle East & Africa)

We can also provide the customized separate regional or country-level reports, for the following regions:

  • North America
  • United States
  • Canada
  • Mexico
  • Asia-Pacific
  • China
  • India
  • Japan
  • South Korea
  • Australia
  • Indonesia
  • Singapore
  • Rest of Asia-Pacific
  • Europe
  • Germany
  • France
  • UK
  • Italy
  • Spain
  • Russia
  • Rest of Europe
  • Central & South America
  • Brazil
  • Argentina
  • Rest of South America
  • Middle East & Africa
  • Saudi Arabia
  • Turkey
  • Rest of Middle East & Africa

On the basis of product, this report displays the production, revenue, price, market share and growth rate of each type, primarily split into

  • Fully Automatic
  • Semi-Automatic
  • Manual

By Application, the market can be split into

  • Integrated Device Manufacturers (IDMs)
  • Outsourced Semiconductor Assembly and Test (OSAT)

The study objectives of this report are:

  • To analyze and study the global Die Bonder Equipment capacity, production, value, consumption, status (2013–2017) and forecast (2018–2025);
  • Focuses on the key Die Bonder Equipment manufacturers, to study the capacity, production, value, market share and development plans in future.
  • Focuses on the global key manufacturers, to define, describe and analyze the market competition landscape, SWOT analysis.
  • To define, describe and forecast the market by type, application and region.
  • To analyze the global and key regions market potential and advantage, opportunity and challenge, restraints and risks.
  • To identify significant trends and factors driving or inhibiting the market growth.
  • To analyze the opportunities in the market for stakeholders by identifying the high growth segments.
  • To strategically analyze each submarket with respect to individual growth trend and their contribution to the market.
  • To analyze competitive developments such as expansions, agreements, new product launches, and acquisitions in the market.
  • To strategically profile the key players and comprehensively analyze their growth strategies.

In this study, the years considered to estimate the market size of Die Bonder Equipment are as follows:

  • History Year: 2013–2017
  • Base Year: 2017
  • Estimated Year: 2018
  • Forecast Year 2018 to 2025

For the data information by region, company, type and application, 2017 is considered as the base year. Whenever data information was unavailable for the base year, the prior year has been considered.

Key Stakeholders

  • Die Bonder Equipment Manufacturers
  • Die Bonder Equipment Distributors/Traders/Wholesalers
  • Die Bonder Equipment Subcomponent Manufacturers
  • Industry Association
  • Downstream Vendors

Available Customizations
With the given market data, We offers customizations according to the company’s specific needs. The following customization options are available for the report:
Regional and country-level analysis of the Die Bonder Equipment market, by end-use.
Detailed analysis and profiles of additional market players.

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Table of content

Global Die Bonder Equipment Market Professional Survey Report 2018
1 Industry Overview of Die Bonder Equipment
1.1 Definition and Specifications of Die Bonder Equipment
1.1.1 Definition of Die Bonder Equipment
1.1.2 Specifications of Die Bonder Equipment
1.2 Classification of Die Bonder Equipment
1.2.1 Fully Automatic
1.2.2 Semi-Automatic
1.2.3 Manual
1.3 Applications of Die Bonder Equipment
1.3.1 Integrated Device Manufacturers (IDMs)
1.3.2 Outsourced Semiconductor Assembly and Test (OSAT)
1.4 Market Segment by Regions

2 Manufacturing Cost Structure Analysis of Die Bonder Equipment
2.1 Raw Material and Suppliers
2.2 Manufacturing Cost Structure Analysis of Die Bonder Equipment
2.3 Manufacturing Process Analysis of Die Bonder Equipment
2.4 Industry Chain Structure of Die Bonder Equipment

3 Technical Data and Manufacturing Plants Analysis of Die Bonder Equipment
3.1 Capacity and Commercial Production Date of Global Die Bonder Equipment Major Manufacturers in 2017
3.2 Manufacturing Plants Distribution of Global Die Bonder Equipment Major Manufacturers in 2017

Key questions answered in this report:

  1. What will the Die Bonder Equipment the grow the rate be in 2025?
  2. What are the key factors driving the Global Die Bonder Equipment with a focus on the Chinese market?
  3. What are the key market trends impacting the growth of the Global Die Bonder Equipment Market?
  4. What are the challenges to Global Die Bonder Equipment Market growth?
  5. What are the market opportunities and threats faced by the vendors in the Global Die Bonder Equipment Market industry?
  6. What are the key outcomes of the five forces analysis of Die Bonder Equipment?

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Strategic suggestions and proposals for the beginners to understand Assessments of the market share from different countries and regions were conducted Top key market players, market share analysis included.

The market observations such as constraints, drivers, threats, opportunities, investment opportunities, challenges, and recommendations are added.

The competitive landscaping mappings of the ongoing trends are discussed. Based on the market estimations, the strategic recommendations are made in the business segments The competitive landscaping mappings of the current trends are detailed. Various companies detailed profiles are included.

The latest technology advancements are mapped with the trends of the supply chain. The analysis of competitiveness between different markets players are added to provide

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