Machinery and Equipments

IC Package Substrate Market Research Report 2017


This report studies IC Package Substrate in China market, focuses on the top players in China market, with capacity, production, price, revenue and market share for each manufacturer, covering

  • Honeywell ACI
  • IBM
  • Unimicron
  • Multek
  • AT&S
  • Aspocomp
  • JCI(MGC)
  • Hitachi?Cable
  • Ibiden
  • Samsung
  • Shinko

Market Segment by Regions (provinces), covering

  • South China
  • East China
  • Southwest China
  • Northeast China
  • North China
  • Central China
  • Northwest China

Split by product Type, with production, revenue, price, market share and growth rate of each type, can be divided into

  • Ball Grid Array(BGA)
  • Chip Scale Package/Chip Size Package(CSP)
  • Flip Chip(FC)

Split by Application, this report focuses on consumption, market share and growth rate of IC Package Substrate in each application, can be divided into

  • Mobile Telephone
  • PC
  • Camera
  • Others

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Table Of Content

1 IC Package Substrate Market Overview
1.1 Product Overview and Scope of IC Package Substrate
1.2 IC Package Substrate Segment by Type
1.2.1 China Production Market Share of IC Package Substrate Type in 2015

2 China IC Package Substrate Market Competition by Manufacturers
2.1 China IC Package Substrate Capacity, Production and Share by Manufacturers (2015 and 2016)
2.2 China IC Package Substrate Revenue and Share by Manufacturers (2015 and 2016)
2.3 China IC Package Substrate Average Price by Manufacturers (2015 and 2016)

3 China IC Package Substrate Manufacturers Profiles/Analysis
3.1 Honeywell ACI
3.1.1 Company Basic Information, Manufacturing Base, Sales Area and Its Competitors
3.1.2 IC Package Substrate Product Type, Application and Specification

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